New Materials and Processing for Microelectronic Devices and Packaging

Ultra-low dielectric constant insulators are needed in electronics devices. New materials and processes have been created for fabrication of embedding air-isolation in electronic and optical devices. Air encapsulated and porous structures provide mechanically compliant, low capacitance interconnects. Other projects include electroless copper plating, rapid microwave processing, investigation of cryogenic cooling, and novel interconnection materials.

Room Temperature Ionic Liquids

Room temperature ionic liquids provide high conductivity, wide electrochemical stability, and zero vapor pressure. New ionic liquids are simple to produce and can be used as electrolytes in batteries and for the deposition of metals (e.g. sodium, lithium, copper, aluminum).

Micro Fuel Cells

Thin-film micro fuel cells using concentrated methanol as the fuel souce, have extremely high energy density. New membranes have been developed which allow the integration of these power sources directly into electronic devices. The membranes have low methanol cross over, which permits the use of highly concentrated fuels. Thin-film cells have designed for powering small electronic devices, such as wireless sensors. The cells overcome problems with traditional PEM fuel cells. The cofabrication of the micro fuel cell with the electronic device enables the smallest form-factor for the self-powered electronic device.

Interconnect Focus Center

The Interconnect Focus Center (IFC) conducts research to discover and invent new electrical, optical and thermal interconnect solutions that will meet or exceed ITRS projections and enable hyper-integration of heterogeneous components for future terascale systems.